Microvias: Low Cost, High Density Interconnects | John H. Lau | Ricky S. Lee | Science & Technology | Engineering | eBooks


Microvias: Low Cost, High Density Interconnects

By: John H. Lau, Ricky S. Lee


Microvias: Low Cost, High Density Interconnects - Adobe eBook

Microvias: Low Cost, High Density Interconnects ~~ Adobe eBook

Adobe eBook

Platforms
Windows Vista / XP / 2000, Mac OS X Tiger

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Price: $99.95


Microvias: Low Cost, High Density Interconnects Summary:

State-of-the-art introduction to high-density interconnect technology.


 

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