eBooks - Science & Technology - Engineering - John H. Lau - Ricky S. Lee - Microvias: Low Cost, High Density Interconnects


Microvias: Low Cost, High Density Interconnects eBook

By: John H. Lau, Ricky S. Lee


Microvias: Low Cost, High Density Interconnects - Adobe eBook

Microvias: Low Cost, High Density Interconnects eBook

Adobe

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Price: $99.95


Microvias: Low Cost, High Density Interconnects Summary

State-of-the-art introduction to high-density interconnect technology.



eBooks  -  Titles  -  Authors  -  Science & Technology  -  Engineering  -  John H. Lau  -  Ricky S. Lee  -  Microvias: Low Cost, High Density Interconnects