eBooks - Science & Technology - Engineering - John H. Lau - Ricky S. Lee - Microvias: Low Cost, High Density Interconnects
Microvias: Low Cost, High Density Interconnects eBook
By: John H. Lau, Ricky S. Lee
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Platforms
Windows Vista / XP / 2000, Mac OS X, Sony Reader Features
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Availability:
Download Now Price: $99.95
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Microvias: Low Cost, High Density Interconnects Summary
| State-of-the-art introduction to high-density interconnect technology. |
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eBooks - Titles - Authors - Science & Technology - Engineering - John H. Lau - Ricky S. Lee - Microvias: Low Cost, High Density Interconnects