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| Various social and environmental reasons drive the push to lead-free technologies. Proposed and enacted legislation in the form of international and national laws and standards and local initiatives seem to control the use of lead in electronics manufacture and waste minimization. This book examines all issues, technical, social, historical as well as legislative, related to the current situation and future plans for lead-free electronics. It was originally published by the authors for internal purposes but has since been updated and taken off the market. These updates include the latest data on cyclic thermo-mechanical deformation properties of lead-free SnAgCu alloys and the comparison of the properties between the standard Sn-Pb and lead-free alloys using the energy partitioning approach. Tin whiskering, solder joint reliability, and lead-free implementation are also covered. |
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eBooks > Titles > Authors > Science & Technology > Engineering > Sanka Ganesan > Michael G. Pecht > Lead-free Electronics
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