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eBooks - Science & Technology - Engineering - Rao Tummala - Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging eBooks

by Rao Tummala

Fundamentals of Microsystems Packaging eBook

Adobe

Platforms
Windows Vista / XP / 2000, Mac OS X, Sony Reader

Features
Advanced navigation, search, bookmarks, and multiple viewing options.

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Price: $89.95

Fundamentals of Microsystems Packaging eBook

Adobe

Platforms
Windows Vista / XP / 2000, Mac OS X, Sony Reader

Features
Advanced navigation, search, bookmarks, and multiple viewing options.

Availability:
Download Now

Price: $115.00

Fundamentals of Microsystems Packaging eBook

Microsoft Reader

Platforms
Windows PC, Windows Mobile 5.0-6.0, Pocket PC 2003

Features
ClearType, advanced navigation, search, personal library, bookmarks, notes, and drawing.

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Price: $115.00

Fundamentals of Microsystems Packaging eBook

Palm

Platforms
Palm, Windows Mobile, Pocket PC, Windows PC, Mac, iPhone/iPod Touch

Features
Advanced navigation, search, bookmarks, and powerful viewing features.

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Price: $120.75

Fundamentals of Microsystems Packaging Summary

Written by Rao Tummala, the field's leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology.

"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the field?s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You?ll find:

*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies?wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing"

"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:

*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing"

eBooks - Titles - Authors - Science & Technology - Engineering - Rao Tummala - Fundamentals of Microsystems Packaging