eBooks - Science & Technology - Technology - Ken Gilleo - Area Array Packaging Handbook : Manufacturing and Assembly
Area Array Packaging Handbook : Manufacturing and Assembly eBooks
by Ken Gilleo
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Platforms
Windows Vista / XP / 2000, Mac OS X, Sony Reader Features
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Availability:
Download Now Price: $131.00
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Platforms
Windows PC, Windows Mobile 5.0-6.0, Pocket PC 2003 Features
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Availability:
Download Now Price: $131.00
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Area Array Packaging Handbook : Manufacturing and Assembly Summary
| *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications*Examines packaging ramifications of high density interconnects (HDI) |
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eBooks - Titles - Authors - Science & Technology - Technology - Ken Gilleo - Area Array Packaging Handbook : Manufacturing and Assembly